PPIC Speaker: Rogier Reinders

 

Rogier Reinders, Global Marketing Director for the Advanced Technologies Business in Dowcorning (a wholly owned subsidiary of The Dow Chemical Company) , studied Economics at the University of Groningen in the Netherlands. Shortly thereafter he was active in biotechnology for IQ Corporation (now DSM Ventures). Subsequently Mr. Reinders started in Dow Corning where he had held various commercial and technical management roles. Presently he serves the Advanced Technologies Business which consists of Photovoltaics and LED lighting, PCB assembly. In this role Mr. Reinders is able to serve customer needs in various exciting market segments with quality materials, stable global supply, and true innovation all within the right commercial framework.

 

PPIC Presentation topic:

BACK IN THE PV GALAXY:THE RETURN OF THE SILICONE MODULE

 

Back in the early days of PV civilization, wisemen looked for the best encapsulation material. They found that silicone was the only material that fulfilled the combined requirements of stability and transparency, and they started making PVmodules with silicone encapsulation with outstanding durability. All was well...

Then, clever minds found that modified EVA could be good enough for 20 years life time module and was cheaper... But now BYD selected silicone encapsulation for their double glass modules with innovative module design, perfected encapsulation and module assembly process to meet harsh environment.

 

2017 PPIC 光伏聚合物国际峰会 演讲嘉宾介绍

道康宁 Rogier Reinders

 

Rogier Reinders，就职于陶氏化学全资子公司 - 道康宁Dowcorning 先进技术业务部全球市场总裁。

 

Rogier Reinders 毕业于荷兰University of Groningen格罗宁根大学经济学专业。毕业后就职于IQ公司（现被DSM帝斯曼收购）生物技术部门。之后加入道康宁公司，先后从事多种工作，包括业务和技术管理等职位。现任道康宁先进技术业务全球市场总裁，负责包括光伏、PCB组装、LED封装等业务，在现有业务框架下为不同的市场部门服务于客户的需求，提供高质量材料，稳定的全球供应和真正的创新。

 

PPIC演讲报告题目：

回顾光伏历程，液体硅胶再次回归

 

内容摘要：

 

       在光伏研究发展初期，人们寻找合适的组件封装材料时发现只有有机硅是最合适的，能满足透明和长期可靠性的要求，采用液体硅胶封装的光伏组件有优异的耐久性能。后来，人们发现经过改性的EVA材料也能使用20年以上，于是产业开始采用EVA作为封装材料。

 

       如今，随着使用范围的扩大，环境差异性的增加，比亚迪公司选择了液体硅胶材料用于光伏组件封装，满足各种严苛条件的要求...